Excellent power, performance and area benefit, proven process maturity
Mobile application has been one of the main driving forces for the recent silicon technology advancement. N7 platform technology delivers significant power, performance and density improvement over N16. As the industry's first available 7nm technology node, it has been widely adopted by many customers for mobile, HPC, automotive and other applications. N7 platform set the record in TSMC's history for both defect density reduction and production volume ramp rate. As of Q1'2019, N7 already accounts for 22% of TSMC's total revenue, and we expect the strong momentum on customer adoption and product tapeouts will continue through 2020 and beyond.
N7+ is our very first EUV process in volume production. EUV simplifies process flow with less masking layers and better process variation control. Together with smaller standard cell libraries and further enhanced device performance, N7+ provides additional power, performance and density benefit with similar defect density as N7. N7+ is in high volume manufacturing now and EUV availability and productivity meets or exceeds production requirements.