Higher density gate count and communication protocol change are the two main driver for BCD integration on more advanced technology. TSMC BCD technology migration to more advanced nodes is more than just power density increase. The digital content also increases. With our newest migration to 40ULP, the BCD addition has no impact to baseline IP.

TSMC is also industry's first to adopt RRAM to make more intelligent BCD with lower die cost comparing to eFlash. Again no impact to baseline IP.

For mainstream products, our effort focuses on developing cost-effective technologies on 8" wafers.