Dr. C. C. Wei is Chairman and Chief Executive Officer of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to this appointment, Dr. Wei was TSMC's Chief Executive Officer from June 2018 to June 2024, and TSMC’s Board of Directors elected Dr. Wei as Chairman and Chief Executive Officer in June of 2024. Dr. Wei was President and Co-CEO from November 2013 to June 2018, and Co-Chief Operating Officer from March 2012 to November 2013. From 2009 to 2012, he was TSMC's Senior Vice President of Business Development. Before that, Dr. Wei was Senior Vice President of Mainstream Technology Business.

Before joining TSMC in 1998, Dr. Wei had served as Senior Vice President of Technology at Chartered Semiconductor and Senior Manager, Logic and SRAM technology development at ST Microelectronics. Prior to that, he was a Member of Technical Staff at Texas Instruments R&D organization.

C. C. Wei received his B.S. degree in electrical engineering from National Chiao Tung University and Ph.D. from Yale University.

Lora Ho is the Senior Vice President of Human Resources for Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).

Ms. Ho joined TSMC in 1999 and worked as Corporate Controller before serving as Chief Financial Officer and Spokesperson from 2003 to 2019. And later she served as Senior Vice President, Europe and Asia Sales from 2019 to 2022. Also, Ms. Ho is the ESG Committee Chairperson since 2011.

Ms. Ho received numerous awards as the "Outstanding Financial Executive" by the Financial Executives Institute, the "Best Companies' Best CFO" of Taiwan and Asia from 2007-2019 by FinanceAsia, and institutional investor magazine. She was also named as one of “Nine of the Most Influential Women in Asian Tech” by Nikkei Asian Review magazine in 2018.

Ms. Ho received her MBA degree from National Taiwan University and a B.A. degree from National Cheng-chi University.

Dr. Wei-jen Lo is Senior Vice President of Corporate Strategy Development at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Dr. Lo joined TSMC in 2004 as Vice President of Operations II and served as Vice President of Research and Development from 2006 to 2009 before he was appointed Vice President of the Company's Advanced Technology Business, and Operations for Manufacturing Technology.

In his over 15 years of services at TSMC, Dr. Lo has contributed greatly to the company's development of advanced technologies, providing comprehensive and innovative solutions to customers' tough technical challenges. Currently he leads a team that has earned a total of more than 1,500 patents globally, including around 1,000 US patents.

Prior to joining TSMC, Dr. Lo was Director of Technology Development and a Plant Manager with Intel Corporation's Technology and Manufacturing Group. From 1997 to 2000, he served as a Factory Manager, responsible for running Intel's development factory in Santa Clara, California. Dr. Lo has also served as an assistant professor at a U.S. university, and worked at the Motorola Research and Development Lab, as well as the Xerox Microelectronics Center.

Dr. Lo received his B.S. degree in physics from National Taiwan University and his M.S. and Ph.D. degrees in Solid State Physics and Surface Chemistry from University of California, Berkeley.

Mr. Rick Cassidy is Senior Vice President of Corporate Strategy Development at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for corporate strategy planning and implementation. He also co-leads TSMC’s Overseas Operations Office which is responsible for supporting the company’s global expansion and accelerating the organizational effectiveness of overseas operations. He joined TSMC North America in 1997 as Vice President of Account Management and was promoted to President and CEO of TSMC North America in 2005. In 2008, Mr. Cassidy was appointed Corporate Vice President of TSMC, responsible for the North American region, and promoted to Senior Vice President in 2014. In more than two decades of service at TSMC, Mr. Cassidy has contributed greatly to the success of the fabless semiconductor business model with his dedication to customer trust while bringing record growth to the Company.

Mr. Cassidy's electronics career began at Fairchild Semiconductor, later acquired by National Semiconductor. Over an 18-year span he rose through manufacturing, engineering, quality and reliability, and marketing, culminating with his appointment as Vice President and General Manager of National's Military & Aerospace Division and Co-Chair of National's General Manager Council.

Prior to entering the semiconductor industry, Mr. Cassidy served as an officer in the U.S. Army. He holds a Bachelor of Science degree in Engineering from the United States Military Academy at West Point. Mr. Cassidy currently serves on the Global Semiconductor Alliance (GSA) Board of Directors, an organization dedicated to the advancement of the worldwide semiconductor industry.

Mr. Y.P. Chyn is Executive Vice President and Co-Chief Operating Officer at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He is responsible for the operation and management of all fabs in Taiwan and overseas. He also co-leads TSMC’s Overseas Operations Office which is responsible for supporting the company’s global expansion and accelerating the organizational effectiveness of overseas operations. Prior to his promotion to Senior Vice President in 2016, he served as Vice President of Operations for Product Development. Before assuming that post, he was Vice President of Advanced Technology Business in TSMC, sharing responsibility for TSMC's advanced technology and 300mm fab operations.

Mr. Chyn joined TSMC when it was founded in 1987 and has made significant contribution to the Company's product engineering capabilities throughout his career. He was Director of Fab 1 from 1997 to 1998, and in later positions supported yield improvement in all new generations of advanced technology, including the 28nm, 16nm, and 7nm nodes. Mr. Chyn also manages sub-nodes including N22 and N12, as well as development of specialty technologies such as radio frequency, high voltage, and image sensors. Mr. Chyn pioneered the development of TSMC's Golden Spice Modeling methodology and Design for Manufacturing program.

Prior to joining TSMC, Mr. Chyn served as an engineer with the Industrial Technology Research Institute's Electronics Research and Service Organization (ERSO-ITRI).

Mr. Chyn earned his B.S. and M.S. degrees in Electrical Engineering from National Cheng Kung University.

Dr. Y.J. Mii is Executive Vice President and Co-Chief Operating Officer at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Dr. Mii joined TSMC in 1994 as a manager at Fab 3 and then joined the company's R&D organization in 2001. In 2011, Dr. Mii was appointed Vice President of Research and Development and later he was promoted to Senior Vice President in November 2016.

In more than two decades of services at TSMC, Dr. Mii has contributed greatly to the development and manufacturing of advanced CMOS technologies in both Fab Operations and R&D. He successfully managed the development of 90nm, 40nm and 28nm technologies. By spearheading the research and development of 16nm, 7nm, 5nm, 3nm, and beyond, he has helped maintain TSMC's technology leadership in the foundry segment of the global semiconductor industry.

Dr. Mii received the IEEE Frederik Philips Award in 2022, recognizing his outstanding accomplishments in the management of research and development. Before joining TSMC, Dr. Mii was a research staff member at IBM Research Center.

Dr. Mii has 34 patents globally, including 25 US patents, and holds a B.S. in electrical engineering from National Taiwan University, as well as an M.S. and Ph.D. in Electrical Engineering from the University of California, Los Angeles (UCLA).

J.K. Lin is Senior Vice President of Corporate Strategy Development and Chief Information Security Officer at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Mr. Lin is actively driving information security and corporate digitalization, as well as applying artificial intelligence and machine learning towards smart manufacturing, R&D, and productivity improvement. He strongly believes in the importance of responsible procurement and is dedicated to creating a sustainable supply chain. Prior to assuming duties in his current function, Mr. Lin served as Vice President of Mainstream Fabs and the Manufacturing Technology Center.

Mr. Lin joined TSMC when it was founded in 1987 as one of the first group of employees transferred from Taiwan’s Industrial Technology Research Institute (ITRI). He began as an Equipment Engineer held and a number of manager positions in Fab 1 and 2. Mr. Lin was also responsible for the construction of Fab 3 and later served as Fab Director of Fab 3, Fab 4, Fab 7, as well as Senior Director of Fab 6, Fab 12, and Advanced Technology Fabs.

Mr. Lin led Fab 6 in its successful volume production of the then highly-advanced 130nm copper process in 2002. He later served as Senior Director of TSMC’s first 12-inch fab from 2003-2008, playing an important role in the smooth transition of the 130nm, 90/85nm, 65/55nm, and 40nm technology nodes to volume production on 12-inch wafers, and setting a solid foundation for the Company’s manufacturing excellence. Mr. Lin also laid the groundwork for automation and intelligent manufacturing in 12-inch fabs as well as production management for GigaFabs.

Mr. Lin also currently serves as an Executive Director on the Board of the Allied Association for Science Park Industries, and a Director on the Board of the Taiwan Electrical and Electronic Manufacturers’ Association.

Prior to joining TSMC, Mr. Lin worked in the Electronic Research & Service Organization (ERSO) of ITRI.

J.K. Lin received his B.S. degree from National Changhua University of Education.

Dr. Cliff Hou is Senior Vice President at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He is also deputy of Mr. Y.P. Chyn. Prior to this post, Dr. Hou was TSMC's Vice President of Design and Technology Platform from August 2011 to July 2018 and later he served as Vice President of Technology Development in August 2018. He began his career at TSMC in 1997 and has since played a key role in the Company's design technology and ecosystem development.

From 1997 to 2007, Dr. Hou established the company's technology design kit and reference flow development organizations. Over the last decade, Dr. Hou led the development of TSMC's Open Innovation Platform® (OIP), which is now the most comprehensive design ecosystem in the global semiconductor industry.

Dr. Hou received the National Manager Excellence Award in 2010 as a pioneer in reference flows and design for manufacturing (DFM) that significantly lowers IC design barriers. He led the Company's OIP project team to win the first National Industry Innovation Award in 2011, presented by the Taiwan Ministry of Economic Affairs (MOEA).

Prior to joining TSMC, Dr. Hou was a section manager specializing in design environment at the Computer & Communications Research Laboratories, Industrial Technology Research Institute (ITRI/CCL) in Taiwan. He also served as an Associate Professor at Kaohsiung Polytechnic Institute (now known as I-Shou University) in Taiwan.

Dr. Hou holds 44 U.S. Patents and serves as a member of Board of Directors in Global Unichip Corp. He received B.S. degree in Control Engineering from Taiwan's National Chiao-Tung University, and Ph.D. in Electrical and Computer Engineering from Syracuse University.

Dr. Kevin Zhang currently serves as Senior Vice President of Business Development and Global Sales at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), where he is responsible for companywide business strategy, including technology roadmap and customer engagement. He is also deputy of Dr. Y.J. Mii. He also co-leads TSMC’s Overseas Operations Office which is responsible for supporting the company’s global expansion and accelerating the organizational effectiveness of overseas operations. Prior to this role, Dr. Zhang was Vice President of Design and Technology Platform and drove advanced IP development when he first joined the company in 2016. He became Vice President of Business Development in 2017.

Before joining TSMC, Dr. Zhang was Vice President of Technology and Manufacturing Group and Director of Circuit Technology at Intel, where he was responsible to key process and design collaterals and co-definition and optimization for Intel products. He led the development of embedded memory technologies from 90nm to 10nm at Intel. Dr. Zhang was elected as Intel Fellow in 2005 and led his teams to win 5 Intel Achievement Awards, the highest technical accomplishments at the company.

Dr. Zhang has published more than 80 papers at international conferences and in technical journals, and is the editor of Embedded Memory for Nano-Scale VLSIs, published by Springer in 2009. He holds 55 U.S. patents in the field of integrated circuit technology. Dr. Zhang was the 2016 International Solid-State Circuit Conference (ISSCC) Program chair and is serving as the conference chair currently. He is on the IEEE VLSI Executive Committee. Dr. Zhang is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE).

He received his bachelor's degree from Tsinghua University in Beijing and his Ph.D. from Duke University, both in electrical engineering.

Ms. Sylvia Fang has served as Vice President and General Counsel at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) since August, 2014. Previously, she had served as the Company's Associate General Counsel. Since Ms. Fang joined TSMC in 1995, she has worked on numerous high-profile corporate transactions, precedent-setting intellectual property and trade secret litigation, the promotion of significant legal changes, and the resolution of corporate governance issues. The Board of Directors has also appointed Ms. Fang as the Corporate Governance Officer and Board Secretary of TSMC, responsible for Board, Audit Committee, Compensation Committee and Shareholders’ meeting related matters.

Ms. Fang jointly founded the Taiwan Association for Trade Secrets Protection (TTSP) in 2015, and served as its Chairman for the first two terms to help promote legal reform of Taiwan's trade secret laws and regulations.

Prior to her career at TSMC, Ms. Fang worked at one of Taiwan's leading boutique intellectual property law firms, TIPLO, where she developed her expertise on general corporate and IP issues.

Ms. Fang's achievements are also widely recognized by the global legal community. In 2005, Asialaw magazine awarded her the “Deep & Far Award for Taiwan In-House Counsel”. She has also cultivated relationships with key government, trade, commerce and securities administrative agencies through her years of promoting important legal changes.

Ms. Fang is an attorney admitted in Taiwan having received her LL.B. degree from National Taiwan University, and her M.C.L. degree from College of Law, University of Iowa.

Dr. Y.L. Wang is Vice President of Fab Operations I at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He joined TSMC in 1992, progressively gaining responsibility in various production management roles at TSMC's fabs during his early tenure, and was appointed TSMC's Vice President of Technology Development in October 2015 prior to the current post.

In his more than 20 years of services at TSMC, Dr. Wang has successfully contributed to mass production of the company's 0.35-micron, 0.25-micron, 0.18-micron, 0.13-micron, 90nm, 65nm, 40nm, 20nm and 16nm process technologies, significantly improving productivity and enhancing defect density. He also joined development of more advanced 10nm, 7nm, and 5nm technologies, and successfully transferred these technologies into fab production.

With a Strong track record of patents, Dr. Wang was awarded as an excellent engineer by the Chinese Institute of Engineers, and received the National Invention Award five times between 2005 and 2011. Currently he has 283 patents globally including 136 U.S. patents.

Dr. Wang received his B.S. degree in Physics from National Tsing Hua University; his M.S. degree in Materials Science from National Sun Yat-Sen University, and Ph.D. in Electrical Engineering and Computer Science from National Chiao Tung University.

Dr. Douglas Yu is Vice President of Pathfinding for System Integration at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to his appointment to Vice President in 2016, Dr. Yu was Senior Director of the Integrated Interconnect & Packaging Division.

Dr. Yu joined TSMC in 1994, serving in a variety of roles throughout his career including backend R&D, and developed technologies critical to the Company’s highly successful transition to copper process at the 0.13 micron generation. Dr. Yu also pioneered TSMC’s wafer-level system integration technologies, including Chip on Wafer on Substrate (CoWoS®), Integrated Fan-Out (InFO), and TSMC System on Integrated Chips (SoIC™), as well as their derivatives.

Prior to joining TSMC, Dr. Yu was a Member of Technical Staff and Project Leader at AT&T Bell Labs in USA, working on sub-micron process, device and integration technologies R&D from 1987 to 1994.

Dr. Yu became a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013, and received the Presidential Science Prize of Taiwan in 2017 as well as the IEEE EPS Outstanding Manufacturing Technology Award in 2018. He has received more than 1,800 worldwide patents while serving at TSMC.

Dr. Yu received his B.S. degree in Physics and M.S. degree in Materials Science and Engineering both from National Tsing Hua University, and Ph.D. in Materials Engineering from Georgia Institute of Technology.

Dr. T.S. Chang is Vice President of Advanced Technology and Mask Engineering at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Dr. Chang joined TSMC in 1995 and was previously Senior Director of Fab12B. With more than 20 years of practical experience in the Operations Organization where he participated in technology development and manufacturing of Fab 1, Fab 4, Fab 8, Fab 12, and Fab 14, Dr. Chang is a key person to successfully transferring TSMC's leading-edge technology into production.

Dr. Chang was elected as a TSMC fellow in 2013, demonstrating his commitment to innovation and engineering excellence. He has 52 patents globally and about half of them are U.S. patents.

Dr. Chang received his B.S. degree in Electrical Engineering; M.S. degree in Electrical Engineering and Ph.D. in Electrical Engineering, all from National Tsing Hua University.

Dr. Michael Wu is Vice President of Technology Development under Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He is currently responsible for 3nm technology development and is also in charge of TSMC’s Technology Development Effectiveness Office. Previously, Dr. Wu was Senior Director of the N3 Platform Development Division in the R&D organization. Dr. Wu joined TSMC R&D in 1996 and has since participated in advanced CMOS technology development from 0.13um, 90nm, 65nm to 28nm, and contributed greatly to successful development of 16nm and 7nm technologies.

Dr. Wu has received multiple recognitions including the National Industrial Innovation Award – Innovative Trailblazer of the Year in 2013, the National Management Excellence Award in 2015, and the Chinese Outstanding Engineer Award in 2017.

Dr. Wu served in several positions in the Executive Committee of the International Electron Devices Meeting (IEDM) from 2013 to 2016, and was Technical Program Chair and General Chair of VLSI-TSA in 2017 and 2018, respectively. Dr. Wu was inducted as a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) for his leadership in CMOS process integration. He has published 46 papers and holds a total of 72 patents in the field of semiconductor technology.

Dr. Wu received his B.S. degree in Electrical Engineering from National Cheng Kung University and both his M.S. degree and Ph.D. in Electrical Engineering from University of Wisconsin-Madison. He also received an EMBA degree in the Institute of Technology Management from National Tsing Hua University.

Dr. Min Cao is Vice President of Pathfinding and Corporate Research under the Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Previously, Dr. Cao had served as Senior Director of TSMC's Pathfinding Division from 2016. Dr. Cao began his career at TSMC in 2002, and has successfully helped develop multiple generations of advanced CMOS technology including N90, N65, N40, N28, N20, and N10.

From 2006 to 2008, Dr. Cao led the development of N40G, TSMC's first technology node utilizing super density scaling. In 2009, he led the development of N28HP, the company's first node utilizing HKMG technology. Dr. Cao later led his team to develop N20, winning the Taiwan Ministry of Economic Affairs' National Industry Innovation Award in 2013. He also led the development of N10 from 2014 to 2016.

Prior to joining TSMC, Dr. Cao worked at Hewlett-Packard Laboratories from 1994 to 1999, PDF Solutions from 1999 to 2000, and Pericom Semiconductor from 2000 to 2002.

Dr. Cao holds a total of 36 patents in the field of integrated circuit technology. He has served on many conference committees, including IEDM and the Symposia on VLSI Technology and Circuits. Dr. Cao received his B.S. degree in Electronic Engineering from Fudan University in Shanghai, M.S. degree in Physics from San Francisco State University, and his Ph.D. degree in Physics from Stanford University.

Y.H. Liaw is Vice President of Fab Operations II at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Since joining TSMC in 1988, Mr. Liaw has accumulated operations experience serving in a variety of engineering and management positions in the Company’s fabs, including director of Fab 5, Fab 8, Fab 15A and Fab 15B.

As Director of Fab 15A, he successfully led the volume production of 28 nanometer technology with innovations in cross-organizational collaboration including the “Super Manufacturing Platform” which enabled smooth technology transfer from R&D to manufacturing, and the “Central Setup Team” which enabled a record-breaking production ramp. For his efforts, he received the R.O.C. National Management Excellence Award as well as the TSMC Medal of Honor in 2013.

As Director of Fab 15B, he started out with 10 nanometer technology in 2017 and migrated to 7 nanometer technology in 2018, establishing TSMC as the first company for 7 nanometer technology mass production in the world.

Mr. Liaw received his B.S. and M.S. degrees in Chemical Engineering from National Tsing Hua University.

Dr. Simon Jang is Vice President of Advanced Tool and Module Development of Technology Development under the Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to this appointment, Dr. Jang served as Senior Director of the Advanced Tool and Module Development Division. Dr. Jang joined TSMC in 1993 and has since been responsible for managing advanced module technology development, including tool and material evaluation and selection, for critical semiconductor production modules.

In his early tenure with TSMC, Dr. Jang held many different positions in the company's research and development function, covering a wide spectrum of module technology. Dr. Jang was Director of Advanced Etch, BEOL (Back end of line) Module, and Platform Module. Under his leadership, the Advanced Module team consistently developed and delivered critical modules for advanced N28/N20/N16/N10/N7/N5 technologies. Dr. Jang was also one of the key contributors for breakthroughs in self-aligned contact formation and FinFET transistor and advanced interconnect fabrication. Dr. Jang has received more than 320 U.S. patents and published 147 papers in semiconductor technology.

Dr. Jang received the “National Industrial Innovation Award” and “National Outstanding Manager Award” in 2019 and 2011, respectively. Before joining TSMC, Dr. Jang was a project research assistant at Microsystems Technology Laboratories, MIT.

Dr. Jang received both his B.S. degree and M.S. degree in Materials Science & Engineering from National Tsing Hua University, and his Ph.D. in Materials Science & Engineering from Massachusetts Institute of Technology.

Mr. Wendell Huang is the Chief Financial Officer and Spokesperson of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).

Mr. Huang joined TSMC in 1999 and has led a number of significant corporate level finance projects, such as the acquisitions of TASMC and WSMC, the sale of Philips' shares in TSMC to institutional investors, and a series of major bond issues in 2010-2013. In his past two decades of service at TSMC, Mr. Huang has been responsible for the management of the Finance Division including Investment Management, Financial Planning, SEC Compliance, Customer Credit, Foreign Exchange Management, Financial Risk Management, and Funding & Cashier. He was appointed Deputy Chief Financial Officer in January 2019.

Prior to joining TSMC, Mr. Wendell Huang worked for ING Barings, Chase Manhattan Bank, Bankers Trust Company, Chemical Bank, and Bank of Boston. Mr. Huang has more than 30 years of working experience in the field of finance.

Mr. Wendell Huang received his B.B.A degree in Statistics from the National Chengchi University and his MBA degree from Cornell University.

Dr. C.S. Yoo is Vice President of More-than-Moore Technologies at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for strategic planning, project management, and customer services of TSMC’s strategic customer program. Prior to this post, Dr. Yoo was Senior Director of TSMC’s Office of Strategy Customer Program in May of 2019. Since joining TSMC in 1988, Dr. Yoo has served in a variety of manufacturing and research & development positions in the Company. From 1991 to 1995, Dr. Yoo was an SRAM program manager, successfully developing and delivering 0.65um, 0.55um, 0.5um, 0.45um, and 0.35um technologies while introducing the triple poly technology to 0.35um to significantly increase the number of gross die per wafer. Dr. Yoo was then promoted to be Deputy Director of the SRAM/DRAM and embedded DRAM Program. In 1996, Dr. Yoo delivered 0.35um DRAM into production. In 1997 he joined the E-Beam Operation (EBO) Division and successfully led the team to deliver masks for key technologies from 0.18um to 5nm. In 2016, he developed customized robots and an auto-particle inspection system to enhance automation. 

With more than three decades of practical experience in semiconductor operations management, Dr. Yoo received the “National Manager Excellence Award” in 2008, recognizing his achievement in developing the world’s most advanced mask technology. In 2017, Dr. Yoo led the EBO team to successfully deliver EUV reticles and pellicles, helping TSMC to introduce EUV into production. 

In 1979, Dr. Yoo graduated with a degree in Chemical Engineering from the National Taipei Institute of Technology (Now the National Taipei University of Technology), and was certified as a professional chemical engineer in the same year. Dr. Yoo then received an M.S. degree and Ph.D. in Chemical Engineering from the Worcester Polytechnic Institute, U.S.A.
 

Dr. Jun He is Vice President of Quality and Reliability and Advanced Packaging Technology and Service at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). His responsibility spans across TSMC foundry eco-system and the Company’s backend business and operations management, such as incoming materials qualification, reliability and certification of new process technology & design IP, manufacturing quality as well as enabling customers for their product qualification and ramp. Prior to this role, Dr. He was Senior Director of Advanced Technology Quality & Reliability Division at TSMC. Since joining the Company in 2017, he has been leading the development of analytical and test methodology to effectively detect reliability defects and screen problematic products. Such innovations accelerated launch and steep production ramp for 7nm and 5nm technologies. Dr. He also revamped TSMC’s quality management system for incoming materials in 2019 and strengthened collaborative relationship with key suppliers.

Prior to joining TSMC, Dr. He was a senior director at Intel Corporation, leading overall quality and reliability of process technology development and manufacturing. His scope included research & development of Si, advanced packaging and test along with Intel worldwide manufacturing operations. Dr. He is a three-time winner of Intel Achievement Awards, the highest technical accomplishments at the company, for his technical leadership on low-k dielectric integration, assembly defect detection and development of advanced one-time programmable read-only memory.

Dr. He holds 36 patents globally, including 28 U.S. patents and published over 50 papers in international conferences and peer-reviewed technical journals. He received his B.S. degree in Physics and Ph.D. in Materials Science from University of California, Santa Barbara.

Dr. Chris Lin is Vice President and Chief Information Officer (CIO) of Corporate Information Technology at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). His responsibility spans across TSMC information technology, including intelligent manufacturing, high performance computing, digital supply chain, eCommerce, team collaboration, modernized workplace, and infrastructure re-engineering. Since joining the Company in 2021 as the CIO, Dr. Chris has been leading the IT team to accelerate TSMC digital transformation for the optimization of business process and fab production by adopting new technology such as AI and ML.

Dr. Lin has 30 years of diverse experience in the IT area, prior to joining TSMC, Dr. Lin was Vice President in Information Technology at Mozilla since 2018. He designed strategy and technology roadmap for transformation, and actively engaged in architecture design review, drove business infrastructure scalability with microservices and cloud native design. He became Director of Enterprise Platform Infrastructure at Facebook between 2016 and 2018, responsible for engineering and software-centric operations for computing platform, runtime, network, security, applications operations, data operations, and device operations for Facebook business.

Dr. Lin received Computerworld Premier 100 IT Leaders Award in 2015 and led his teams winning multiple Innovation Awards in IT industry through his career.

Dr. Lin received his B.S. in Electrical Engineering from National Taiwan University. He received his M.S. and Ph.D. both in Electrical Engineering and Computer Science from University of California at Berkeley.

Mr. Jonathan Lee is Vice President of Corporate Planning Organization at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for operation resources planning and strategic planning.

Prior to this role, Mr. Lee was Senior Director of TSMC’s Strategic Planning Division from May 2021. Mr. Lee began his career at TSMC in 2007, and has served in a variety of strategic finance positions in the Company. From 2007 to 2010, Mr. Lee was controller of TSMC’s Mainstream Technology Business, Advanced Technology Business, and Research & Development, leading a number of significant corporate business development and investment projects such as specialty technologies and capacity expansion of TSMC’s Shanghai 8-inch fab. Mr. Lee became Senior Director of Finance Business Development in February of 2012, and had since been supporting TSMC’s success by conducting several strategic projects for capacity expansion including the establishment of TSMC Nanjing 12-inch fab in 2017, TSMC Arizona 12-inch fab in 2020, and TSMC Japan 3DIC R&D Center in 2021.

Prior to joining TSMC, Mr. Lee was the President for Biomorphic Microsystem Corporation, and Finance Director in Macronix International Co. Ltd. Mr. Lee has more than 25 years of working experience in the field of semiconductor and finance.

Mr. Lee received his B.S. degree in Chemistry from Chung Yuan Christian University in Taiwan, and his MBA degree from Baruch College, City University of New York.

Dr. Arthur Chuang is Vice President of Facility Division at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He is responsible for the planning, design, construction, and maintenance of new fabs, as well as the operation and upgrade of existing fab facilities. Dr. Chuang joined TSMC as an equipment engineer in 1989 and transitioned to facilities, dedicating himself to facilities duties for more than 25 years. Dr. Chuang successfully led the Facilities Division to meet the tight construction schedule of Fab 15B, TSMC Nanjing, and Fab 18A, and he engages in continuous efforts to enhance and integrate facility systems.

Dr. Arthur Chuang drives the Company’s green manufacturing initiatives, which includes climate change and energy management, water management, waste management, and air pollution control to achieve the Company’s ESG objectives. He is Director of the TSMC Charity Foundation, and has used his expertise to support related projects such as aiding in reconstruction from flooding caused by Typhoon Morakot in 2009, and from the Kaohsiung gas explosion in 2014, all of which helped TSMC to fulfill its corporate social responsibility.

Dr. Arthur Chuang is the Chairperson of the Steering Board in SEMI High-Tech Facility Committee from 2018. Dr. Chuang also serves as an adjunct professor-rank specialist at Department of Civil Engineering in National Taiwan University.

Dr. Chuang received the “Ten Outstanding Project Managers Award” in 2011 and the “National Industrial Innovation Award” in 2015. Prior to joining TSMC, Dr. Chuang served at Texas Instruments Taiwan as a Process Engineer.

Dr. Arthur Chuang received his B.S. degree in Mechanical Engineering from National Taiwan Institute of Technology（Now the National Taiwan University of Science and Technology）, and Ph.D. degree in Civil Engineering from National Taiwan University.

Dr. L.C. Lu is Vice President of Research & Development / Design & Technology Platform at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and a TSMC Fellow. Dr. Lu is responsible for supporting design enablement to meet a wide range of requirements from the Company’s broad customer base. Prior to this role, he served as function head of Design and Technology Platform from 2018.

Since joining TSMC in 2000, Dr. Lu held a number of management roles related to design services. Dr. Lu collaborated with process RD to innovate Design and Technology Co-Optimization (DTCO) to enhance speed, power and density for TSMC’s new process technologies. He has worked closely with design ecosystem partners through the TSMC Open Innovation Platform^® (OIP) to provide comprehensive design solutions and IPs to enable high density, high performance, automotive, RF, 2.5D and 3D designs for different customer applications.

In 2012, Dr. Lu received Taiwan’s National Outstanding Manager Award and was elected as a TSMC Fellow. He is one of TSMC’s most prolific inventors with more than 100 patents in the United States and other countries. 

Dr. Lu received his B.S. in Electrical Engineering from National Taiwan University, M.S. in Computer Science from National Tsing Hua University, and Ph.D. in Computer Science from Yale University. 

Mr. K.C. Hsu is Vice President of Integrated Interconnect & Packaging at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for the development of TSMC’s system integration technologies, including 3D IC and advanced packaging. Prior to this role, Mr. Hsu was Taiwan Country Manager for Micron Technology, responsible for the company’s overall operations in Taiwan including two manufacturing sites. Mr. Hsu also served as President of TSMC Washington, TSMC’s first fab in the United States, where he successfully improved performance to reach the corporate average. He possesses more than 30 years’ experience in the semiconductor industry and has a track record of proficiency at technology transfer and optimization, yield improvement, and increasing capacity at new fabs.

Mr. K.C. Hsu received his B.S. in Physics from National Taiwan University in 1986 and his M.S. in Technology Management from National Chiao Tung University in 1994.

Mr. Ray Chuang is Vice President of Fab Operations I at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Since joining TSMC in 1997, Mr. Chuang has served in a variety of production management positions at TSMC's fabs, and has successfully contributed to mass production of the Company's 90nm, 65nm, 40nm, 20nm, 16nm, 10nm, 7nm, and 5nm family process technologies. In 2020, Mr. Chuang was appointed as Senior Fab Director of Fab 18A and successfully led his team to produce the industry-leading N5 process technology, and then produced N4 process technology in 2022. TSMC has become the first company in the world to produce the 5nm family process technology, providing the most advanced and comprehensive technologies and services to the Company’s customers.

Prior to joining TSMC, Mr. Chuang worked for Vishay Siliconix and Intel respectively as senior engineer between 1989 and 1995. He was a project manager at TI-Acer from 1995 to 1997.

Mr. Chuang has more than three decades of practical experience in semiconductor operations management, and holds 52 patents globally, including 30 U.S. patents.

Mr. Chuang received his B.S. in Materials Science & Engineering from National Tsing Hua University, and dual M.S. degree in Materials Science & Engineering and Engineering Economics System from Stanford University.

David Keller is President and Chief Executive Officer of TSMC North America, a wholly owned subsidiary of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to this appointment, he was President of TSMC North America. Mr. Keller has three decades of semiconductor industry experience and joined TSMC in 1997 as Director of Account Management for North America, making significant contribution to ensure the best customer experience in North America over the last twenty years.  
 
Prior to joining TSMC, Mr. Keller served as sales and marketing executive at National Semiconductor. He held several senior sales and marketing roles during his career at National, such as Director of the networking segment business unit and VP of Americas marketing. Prior to National, Mr. Keller was a sales engineer at Fairchild Semiconductor until it was acquired by National. Mr. Keller began his career as a product and process engineer at Honeywell in Minneapolis, Minnesota, then lived in Phoenix, Arizona, before settling in California.  

Mr. Keller earned his Bachelor of Science degree in Electrical Engineering (B.S.E.E.) from North Dakota State University and his MBA degree from the University of St. Thomas, St. Paul, Minnesota.

Mr. Paul de Bot is President of TSMC Europe. Mr. Paul de Bot joined TSMC in 2015, and after roles in account management, was appointed General Manager EMEA in 2022 and President in 2024, responsible for the TSMC business in Europe and Israel. Mr. Paul de Bot started his career at Philips in the area of video technology, reaching the position of Chief Strategy Officer of the digital TV systems division of Philips. In 2003 he joined Philips Semiconductors (which later became NXP Semiconductors) as Vice President Strategy & Business Development for their consumer, automotive and identification businesses, respectively. Prior to joining TSMC, Mr. Paul de Bot had further executive roles in the software industry and in corporate finance.

Mr. Paul de Bot received his M.S. in EE and Engineering Doctorate in Telecommunications from Eindhoven University of Technology of The Netherlands, and his M.S. in Business Valuation from TIAS Business School of The Netherlands.

Makoto Onodera is Representative Director and President of TSMC Japan, a wholly owned subsidiary of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), and joined the Company in 1997. 

Prior to his career at TSMC, Makoto Onodera was Senior Marketing Engineer at Applied Materials Japan, Inc. where he was responsible for advanced Dielectric Chemical Vapor Deposition systems in various sales and marketing functions.

Makoto Onodera received his MBA degree from the George H. Atkinson Graduate School of Management at Willamette University.

Roger Luo is the President of TSMC China and TSMC Nanjing, both are wholly owned subsidiaries of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He is responsible for TSMC’s business development in China and operations of the TSMC China and TSMC Nanjing subsidiaries.

Mr. Luo joined TSMC in 1994. He has served as business manager for the Asia Pacific region and the Head of Operations for TSMC Europe. Mr. Luo has been serving as the head of China sales region since 2003, the President of TSMC Nanjing since 2016, and the President of TSMC China since 2020. In these roles, Mr. Luo is responsible for TSMC’s operations and business development efforts in China, as well as supporting the long-term developmental needs of TSMC’s customers and industry partners.

Prior to joining TSMC, Mr. Luo worked as an IC designer for a decade with the Industrial Technology Research Institute’s Electronics Research and Service Organization (“ERSO-ITRI”) and the Twinhead Computer International Corporation. He has a total of over 35 years of work experience in various areas of the semiconductor industry.

Mr. Luo received his MBA degree from Peking University in Beijing, China, and his Bachelor of Science degree in Control Engineering from Taiwan Chiao-Tung University.