To maintain its technology leadership, TSMC plans to continue investing heavily in R&D. While TSMC’s 2nm and 14 Angstrom advanced CMOS logic nodes are progressing through the development pipeline, the Company’s exploratory R&D work is focused on nodes beyond 14 Angstrom, and on areas such as 3D transistors, new memories and low-R interconnect, to lay a strong foundation to foster the development of innovative technology platforms in the future. TSMC’s 3DFabric^® advanced packaging R&D is developing innovations in subsystem integration to further augment advanced CMOS logic applications. The Company maintains its intensified focus on new specialty technologies such as RF and 3D intelligent sensors for 5G and smart IoT applications. TSMC research continues to develop novel materials, processes, devices and memories that may be adopted in the distant future, ten years and beyond. The Company also continues to collaborate with external research bodies from academia and industry consortia alike with the goal of gaining early awareness and adoption of future cost-effective technologies and manufacturing solutions for its customers. With a highly competent and dedicated R&D team and unwavering commitment to innovation, TSMC is confident in its ability to drive future business growth and profitability for years to come, by delivering advanced competitive semiconductor technologies to its customers.