Maintaining reliable production capacity is a key manufacturing strategy at TSMC. The Company currently operates four 12-inch GIGAFAB^® facilities – Fab 12, 14, 15 and 18. The combined capacity of the four facilities exceeded 12 million 12-inch wafers in 2023. Production within these facilities support 0.13μm, 90nm, 65nm, 40nm, 28nm, 16nm, 7nm, 5nm and 3nm process technologies and their sub-nodes.

The GIGAFAB^® facilities are coordinated by a centralized management system known as super manufacturing platform (SMP) to provide customers with consistent quality and reliability, greater flexibility to cope with demand fluctuations, and faster yield learning and time-to-volume production, as well as lower-cost product requalification. In July 2023, TSMC inaugurated its global R&D center specializing in the technology development of 2nm nodes and beyond and to support the exploration of new materials and research on transistors structures. In addition, in response to strong market demand for 3DIC, TSMC opened and started operating its Advanced Packaging Fab 6 also in June 2023 as to provide comprehensive semiconductor manufacturing services from frontend to backend and testing.

		Mini	Mega	Giga
Profile	Monthly 300mm capacity (pcs)	~10K	~25K	>100K
Customer Values	Operating cost	High	Medium	Low
		Flexibility	Limited	Medium	High
		Ramp-up agility	Limited	Medium	High
		Cycle time	Long	Medium	Short
		Delivery precision	Limited	Medium	High