Maintaining reliable production capacity is a key manufacturing strategy at TSMC. The Company currently operates six 12-inch GIGAFAB^® facilities – Fab 12, Fab 14, Fab 15, Fab 18, Fab 20, and Fab 22. The combined capacity exceeded 12.74 million 12-inch wafers in 2024. Production within these facilities support 0.13μm, 90nm, 65nm, 40nm, 28nm, 16nm, 7nm, 5nm and 3nm process technologies and their sub-nodes. The GIGAFAB^® facilities are coordinated by a centralized management system known as super manufacturing platform (SMP) to provide customers with consistent quality and reliability, greater flexibility to cope with demand fluctuations, and faster yield learning and time-to-volume production, as well as better-function and lower-cost product requalification.

In 2024, TSMC established 2nm advanced manufacturing facilities in Hsinchu and Kaohsiung, and expanded advanced packaging capabilities in Chiayi and Tainan. These efforts help clients accelerate innovation to meet the rapidly changing market challenges and satisfy greater demand brought by the growth of AI. Besides, to better serve the needs of global customers, TSMC has made significant progress at several overseas production sites, such as those in Arizona, U.S., and Kumamoto, Japan, enhancing the maturity and stability of its global operations.