The University FinFET Program aims to open a whole new arena for researchers and students to explore their ideas and fuel their curiosity and passion for the exciting and fast-growing field of semiconductors.

The program offers the industry’s most successful fin field-effect transistor (FinFET) technologies with multi-project wafer (MPW) services and design collateral, for TSMC’s 16-nanometer (16nm) and 7-nanometer (7nm) processes, covering both logic designs and radio frequency (RF) designs. Working with service partners in Asia, Europe, Japan, and the United States, TSMC is also providing design collateral for teaching purposes, as well as for research projects leading to silicon test chips. The design collateral for teaching includes tutorial design cases and training materials.

Academic institutions interested in joining the University FinFET Program are welcome to contact one of the following TSMC service partners in their region to begin the application process. For contact information, please click on the icons below for more details.